Taiwan Semiconductor Manufacturing Co. (TSMC) announced that it will start production of ultra-advanced 2nm chips by 2025. It said the 2nm node technology will be based on nanosheet transistor architecture, which is a completely different infrastructure from the FinFET infrastructure currently. used to make its 5nm chips.
The semiconductor giant also said it will get the next version of ASML’s most advanced chip-making tool called High-NA EUV which uses extreme ultraviolet to produce beams of focused light that create microscopic circuits on chips. Interestingly enough, TSMC has claimed that it will receive the machine in 2024 even though its close rival Intel will also use the machine for mass production in 2025.
While this is the first time TSMC has publicly committed to a 2nm chip production schedule, it is also introducing 3nm chip production technology in the second half of this year. The new technology is expected to debut on Apple Macs with M3 chips and iPhone 15 models with A17 chips.
Even though the Taiwanese company currently dominates the global chip manufacturing market, its rivals have also announced new technology with similar timelines. Another big rival, Samsung, said in April that it would produce 3nm chips by the end of June and 2nm chips by 2025, putting it in direct competition with TSMC.
As for Intel, the US chipmaker plans to have more advanced chips by 2024 and last year announced a 1.8nm technology called 18A. Intel CEO Pat Gelsinger gave an update on the technology a few months ago, saying it was “six months ahead of schedule” and that the company had pushed the technology ahead of its schedule. launch until the end of 2024.
The United States and Japan also recently formed a partnership to develop 2nm chips by 2025 in a bid to keep pace with TSMC. Local companies from both countries will collaborate on research for design and manufacturing and will receive grants to cover development costs.
(Source: Nikkei Asia, Reuters)